... the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing ... repair, inspection of finished goods to shipment arrangementOur assembly competence:Stencil size/range: 736 × 736mmMinimum IC pitch: 0.30mmMaximum ... 74mmBGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)QFP ...