EMS for PCB Assembly in SMT/DIP Process with Metal Sheet and Lead-free Technology Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product qualityThe operation we can handle for you is from the bare PC board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangementOur assembly competence: Stencil size range: 736 × 736mmMinimum IC pitch: 0.30mmMaximum PCB size: 410 × 360mmMinimum PCB thickness: 0.35mmMinimum chip size: 0201 (0.2 × 0.1)/0603 (0.6 × 0.3mm)Maximum BGA size: 74 × 74mmBGA ball pitch: 1.00mm (minimum) or 3.00mm (maximum)BGA ball diameter: 0.40mm (min) or 1.00mm (maximum)QFP lead pitch: 0.38mm (minimum) or 2.54mm (maximum)Frequency of stencil cleaning: 1 time/5 to 10 piecesE-mail us to find out how we can fill your requirementsWe sincerely hope we can become your supplier in Far East
PCB Assembly
