Detailed Product Description
Oriental Fast Assembly Ltd specializes in producing the various electronic products based on your designs and assemble pcb for all kinds of sample, small and medium volume. The product field includes but are not limited to:
Industrial control
Alarm products
Measurement device
Telecom audio and video
Consumer electronics
Enabling you to focus on products development and sales, we can solve your production technology issues and take care of products quality.
The operation we can handle for you is from the bare board fabrication, full component procurement, SMT/BGA/DIP assembly, inspection of finished goods to shipment arrangement.
1.2 automated manufacturing SMT lines(All of them support the chips up to 0402, and support micro-BGA and IC, Rohs products).
2. 1 Wave Soldering Line, supporting Rohs products.
3. 2 Hand Manual Soldering Lines for DIP, supporting Rohs products.
4. SMD capacity is 500,000chips/day with two shifts.
Our assembly competence:
Stencil size/range: 736*736mm
Minimum IC pitch:0.30mm
Maximum PCB size: 410*360mm
Minimum PCB thickness:0.35mm
Minimum chip size:0201
Maximum BGA size:74*74mm
BGA ball pitch: 1.00mm(min), 3.00mm(max)
BGA ball diameter:0.4mm(min), 1.0mm(max)
QFP lead pitch: 0.38mm(min), 2.54mm(max)
Frequency of stencil cleaning: 1 time/5 to 10 pieces
