Automatic Die Bonder For LED (Multi-purpose)
Automatic Die Bonder For LED (Multi-purpose) MB362 1.UPH: 14K 2.Work Holder Table: 10" x 4" 3.Multi-Wafer Table: 6" x 6"
High PerformanceReal time DBI even maintain UPH 18000/Look ahead and beforeShorter process distance/preform and bongingKeep quality,shorten useless movement
New Twin Stamping UnitHigh stability by new twin stamping structure with single epoxy stage
Easy Set upAuto chip centering functiom/shorten set-up time
Easy OperationDevice conversion time:1 hour(Hardware:15min Set up:45min)
Automatic Die Bonder For LED (Multi-purpose)
