Automatic Die Bonder For LED (Multi-purpose) MB362 1.UPH: 14K 2.Work Holder Table: 10" x 4" 3.Multi-Wafer Table: 6" x 6"
Product Characteristics:
KB-2600 automatic die bonders, general-purpose device specially designed for semiconductor packaging, are applicable to die bonding of different materials such as IC, IC cards and LEDs. The technological background of die bonders originates from Japanese Toshiba. Thanks to their high precision and good stability, KB-2600 automatic die bonders are the optimal choice for die bonding of semiconductor separation devices.
Product Specifications:
Die-bonding Speed: 550ms/DieDie-bonding Precision: +/- 2milApplicable Chips: 7 - 80milApplicable Support: No LimitationChip Platform Deck: 8“or 6“Support Platform Deck: 4 *8 Double Grooves (the Biggest Model of Platform Desk: 4 * 16.5)Die Bonding Mode: Absorbing Revolving Die Bonding ArmsGluing Mode: Transfer Printing Revolving Gluing ArmsVision System: 256 Grayscale-type Image Comparison SystemPlatform: Microsoft Windows NTPower Source: Single Phase Alternating Current: 220V/50HzGas Source: Positive Pressure: 5Kg/cm2, 69L/min; Negative Pressure: 660mmHg, 25L/minDimensions Weight: 40 * 38 * 75/ 550KgASM Automatic Die Bonder LED making machine
