Detailed Product Description
introduction
Torch Repair workstation BA1600+ is new product for BGA chip repairing market. It can deal with BGA, CSP, LGA( Land Grid Array), Micro SMD, MLF (Micro-Lead Frame ),BCC ( Bumped Chip Component ) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCB.
2.1 function introduction
1Adopt best heating material to control disassemble and weld for BGA.
2Hot air and temperature can be adjusted, and generating high temperature rotate air.
3Moving heating head, easy operation.
4Temperature can be controlled independently on the top and in the bottom. Heating temperature can be displayed.
5Large power wind motor can cool rapidly to make PCB perfect.
6With different size hot air nozzle. It is easy to replace.
7Adjusting PCB frame with anti-scald protection design
8Support frame in the BGA welding district, adjust support height to avoid going down of welding district.
920 segments warm-up controlling, it can save 2 groups setting temperature profiles.
10With alarm and remind function after disassembly and weld. The circuit can cut off when short circuit. With super temperature protection function.
11Hand vacuum absorb pen to absorb BGA, the suction can be adjusted.
12It is suitable for lead and lead free welding.
Parameters and specification
input voltage | AC220V?? 50/60Hz? 10A |
system power | 1400W |
Heating power in the bottom/ highest temperature | 600W/350 |
Heating power of heating head/ highest temperature | 800W/450 |
Temperature feedback | RTD sensor, close loop control |
Flux of hot air head | 8,16,24 L/Minute can be chosen |
Vacuum system | With air pump |
Max chip size | 70mm*70mm |
Min chip size | 5mm*5mm |
Max chip weight | 55g |
Max PCB size | 400mm*350mm |
Max thickness of PCB | 3mm |
Suitable chip | BGA, CSP, LGA( Land Grid Array),QFP |
Dimension | 545*440 *488mm |
weight | about 20KGS |
Adjustment accuracy | 0.025mm |
Min foot space | 0.3mm |