Detailed Product Description
BGA3200 function:
BGA3200 adopt integrative structure design to repair different size BGA QFP CSP and other chips.
BGA3200 is made up of optical position picking system hot air reflow welding system and software controlling system.
Optical position picking system:
A. High precision line orbit and rotary platform can achieve four
degree adjustment of X-Y-Z and nozzle angle Φ(turn 360°)
B. Exact optical picking system is made up of CCD camera optical components and light supply which generate by double color
prismatic technology (have been patent), it can observe and
achieve superposition between PCB pad and foot of components.
Max BGA size is 20*20mm. Max is 50*50mm.
C. High definition CCD camera can provide PAL and VGA two lines output signal, with zooming in, adjusting , foci automatically,
software operation , 30X optical lens, clearly showing BGA and PCB on the screen.
D. The accuracy of BGA3200 is ±0.02mm.
Hot air reflow welding system:
1. Top and bottom temperature zones are heat and controlled
(controlling and measuring temperature) independently. Infrared
pre-heat on the bottom, hot air heat on the top.
2. Using international advanced infrared heating board on the
bottom to avoid PCB warping because of asymmetrically heating.
Infrared is 2-8 μm unvisible light(wave length is 2-8μm , the
feature is same absorb and refraction for white and black, avoid
temperature difference because of different position), the working life is 10 thousand hours.
3. Top heating head is import from Germany, the special structure
can generate stable and equal rotate air to get perfect effect.
Replace nozzle is easy, any angle in 360°can be set.
Software controlling system:
1. Software controlling system can control unsolder and weld
process, different BGA welding profile and reworking profile can be
set in computer according to detail request.
2. Every profile can achieve 40 temperature point simulation.(40
segment temperature profile can be controlled.) to improve welding effect. Using two measuring temperature head, one is used
measuring and controlling in heating zone, the other is used
measuring real temperature of solder components which is better to amend temperature in heating zone.
3. Automatically generating reflow welding temperature profile
when welding and save in computer which can be use at any time.
LCD screen can display profile. It can show two group temperature parameter and working time.
4. With good quality PC machines( windows XP) system and BGA
rework software, it can set technology parameters according to
different components.
BGA3200 Parameters:
dimension: 1100mm*720mm*620mm
Total power: 2000W
Top heating power: 800W
Bottom pre-heating power: 1200W
voltage : 50Hz
Controlling mode : manual/automatic/program
Picking accuracy: ±0.02mm
Position system : Double prismatic technology
PCB size: Max400*300mm,Min30*10mm
PCB thickness: 0.5-3mm
Software controlling system: Base on windows software
Picking components size: Max20*20mm,Min7*7mm
Picking strength: 2.0N
Temperature controlling system: Intelligent temperature controlling system, closed loop control
PCB transmission: Automatic move
PCB drive: Precision orbit
profile: 40 segment temperature
weight: About 50kgs
Accessory :
Computer : 1 setstandard configuration
BGA reball kit: 1 standard configuration
flux solder : 100g standard configuration
flux tin : 1 standard configuration
clean water : 1 standard configuration
