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Hot Saling Experiment Solderless Breadboard BB-102B, 830 Tie point
Hot Saling Experiment Solderless Breadboard BB-102B, 830 Tie point

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Hot Saling Experiment Solderless Breadboard BB-102B, 830 Tie point  

Detailed Product Description

Solderless Breadboard
Dimensions: 56.5x165.5x8.5mm
1 Terminal Strip: 630 Tie-point
1 Distribution Strip: 200 Tie-point
3 Binding Posts
ABS Plastic Material
Black Aluminum Plate: 105x183x8.5mm
Completelyy Reusable
Coloured Coordinates for Easy Component Placement
Phosphor Bronze Nickel P;ated Spring Clips
Accepts a Variety of Wire Sizes (20~29AWG)
Voltsge/Current: 300V/3~5A

PRODUCT PICTURE

  

   

Hot Saling Experiment Solderless Breadboard BB-102B, 830 Tie point

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