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Hot Saling Experimnet Solderless Breadboard, 630 Tie points
Hot Saling Experimnet Solderless Breadboard, 630 Tie points

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Hot Saling Experimnet Solderless Breadboard, 630 Tie points    

Detailed Product Description

Solderless Breadboard
Dimensions: 11x165.5x8.5mm
1 Terminal Strip: 630 Tie-point
1 Distribution Strip: 100 Tie-point
ABS Plastic Material
Completelyy Reusable
Coloured Coordinates for Easy Component Placement
Phosphor Bronze Nickel Plated Spring Clips
Accepts a Variety of Wire Sizes (20~29AWG)
Voltsge/Current: 300V/3~5A

PRODUCT PICTURE

  

   

Hot Saling Experimnet Solderless Breadboard, 630 Tie points

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