Type

TZB450A

TZB450B

TZB450C

Coating method

Resistance evaporation coating + Glove box

Magnetron sputtering coating + Glove box

Resistance evaporation + Magnetron sputtering + Glove box

Film types

Simple substance, Oxides, Dielectrics, Semiconductor compound films, etc.

Metal / Nonmetal films, etc.

Simple substance films, Semiconductor films, Organic films, Oxide films, Reaction films, Dielectric films, Superconductor films, Metal ceramic films, Optical films, etc.

Power supply

Evapourate power supply

DC/Bipolar pulse/RF power supply

evapourate / Bipolar pulse power supply

Electrodes and targets

electrodes

Several magnetron sputtering targets

electrodes, magnetron sputtering target

Dimension of the vacuum chamber

Φ450×H400 mm

Structure of the vacuum chamber

Pre-open vertical structures, Postposition pumping systems, Manual push-and-pull manner

Highest attained vacuum

6. 6×10-5 Pa

Vacuum pumps

Molecular pump + Mechanical pump

Pumping speed

Pumping time≤20 min (Molecular pump) / 50 min (Diffusion pump), from atmospheric pressure to 10-3Pa

Film uniformity

The fluctuations of the film thickness are less than 5%

Structure of the electrodes

electrodes

Magnetron sputtering

pulse power supply + permanent magnetic targets× 1-3

Baking temperature of the workpiece

Adjustable and controllable from room temperature to 300 °C (PID Temperature Control)

Movement of the workpiece

0-20 rpm adjustable and controllable stepless speed change revolution / rotation

Vacuum control

Manual Control

Vacuum measurement

Low-high digital composite vacuum gauge × 2

Vacuum control

Manual / PLC / PLC + HMI control

Protection

Alarm and automatic protection function for water depletion, abnormal flow, over current flowing, over voltage, and electrical shutdown, etc.

Basic parameters

Power≥12 KW; Served area: 9 m2; Weight: ~800 kg

Optional devices

Quartz oscillator film thickness monitor, Hall ion source, Water cooling & recycling machine, Anti-sputtering cleaning, Air compressing machine