Pules Heat FPC Bonding Machine for Touch Panel The machine is applicable to bond FPC onto ITO or LCD substrate for touch panel.
Pulse Heat FPC Bonding Machine for Touch Panel
Machine Function
1.1 The machine is semi-auto main-bonding machine. It is designed for bonding FPC onto LCD or ITO.
Manually load and unload LCD or ITO with FPC pre-bonding. Machine will finish main-bonding automatically.
1.2 It is applicable to bond FPC onto 1.8' ~3.5' LCD or ITO.
1.3 Pulse heating mode make temperature rising and cooling fastly.
Basice Parameter
Outer Dimension(L×W×H)mm:680×750×1680mm
Weight:200KG
Power Supply:1Phase AC220V/110V 50-60Hz
Ambient Request:Clean without dust, clean room(CLASS1000)
Work Pressure / Tube Diameter: 4~6bar Dry Gas SourceØ 8
Work Height:800 mm
Suitable Product Size: 1.8–3.5″
LCD size: 15*16~160*160mm(W*L)
TAB size: 15*16~160*160mm(W*L)
Bond Head Size: 3×60mm (customization)
Bond Head Pressure: 20N–400N
Heat Mode:Up and bottom pulse heat.
Temperature Control Accuracy:±0.5°C
Bonding Time:2-20s
Bonding Accuracy:≤±0.005mm
Pulse Heat FPC Bonding Machine for Touch Panel
