SPECIFICATIONS MATERIAL: (INSULATION) HEAT-SHRINKABLE POLYOLEFIN, (SOLDER) LEAD-FREE TIN, (RINGS) MELTABLE THERMALLY STABILIZED THERMOPLASTIC. SOLDER MELTING TEMP: 138℃, FLUX ACTIVATED ROSIN WORK TEMP: -55℃ to +125℃ SHRINKING TEMP: >200℃ DIELECTRIC STRENGTH: 2kV PROTECTION TYPE: IP 67