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BD-M12B FOG and FOB Main Press Bonding Machine
BD-M12B FOG and FOB Main Press Bonding Machine

BD-M12B is a manual FPC and PCB main press bonding machine. It is used for pasting FPC on PCB or other Panels with IC. Features: Platform can be adjusted, it adopts vacuum adsorption during pasting; PCB has vacuum adsorption or pressing fits; Rodless cylinder drives the platform move linearly; Platform is made of high abrasive resistance aluminum alloy or anti-static material; FPC platform can be adjusted at X, Y, Z and direction( using micrometer and θdirection have axletree); Double startup switch ensures the operators'safety; When pressing the emergency switch, the thermal indenter rises up; the platform will be reposition only after the emergency switch reset; Pressure/temperature/time display and adjusting device are fixed at the visible front of the machine; the adjusting device can be locked up to avoid changing the setting by wrong operation; Have shifter fitting to select automatic or manual production mode; Have account function(can clear to zero) static eliminator can be selected according to the machines dimension, the function scope covers 2 hot pressing area; static eliminator can be selected according to the machines dimension, the function scope covers hot pressing area; Cylinder uses worldwide well-known brand component such as SMC or CKD and etc; Indenter and cylinder have counterbalance valves which used to eliminate deadweight; Main spare parts are all imported; Temperature controller can set maximum and minimum limits, if the temperature is out of this limit, the machine wont be on production status; Have sound and light alarm function.

Specifications:

Item

Specification

Scope of applicationFPCTCPPCB and so on
LCD size112.1inch
FPCMax:15280mm
Number of FPCMax:8
Size of indentermain press 300*1.5mm(can be customized)
Number of indenters1
Cylinder DiameterØ63
Pressure10~800N
Silicon rubber rolling fittingRoll the silicon rubber back and forward manually
Heating modePermanent heating
Heating temperatureRT400°C
Temperature tolerance±3°C
Working period13S(Bonding time is :10S)
Time set130S
Contrapuntal modeContraposition to XYθ manually, which is helped by CCD image
LCD localizingLocalize by locating block
XY adjust the distance of FPC workbench±6.5mm
θ adjust the angle of FPC workbench±15°
Bonding Definition±0.01mm
Smallest lens spacing6mm
Fitting Pitch≥45 um
Magnification times of CCD80160
Center-to-center lens spacing11200 (mm)
CCD fixing modeUp contraposition
Monitor8 inch LCD(2pcs)
Movement mode of workbenchRodless cylinder + linear guide rail
Rating Power2000KW
Power supplyAC220V,50/60 HZ
Supply0.50.7MPa
External Dimension800L×830W×800 Hmm
Weightabout 200kg

BD-M12B FOG and FOB Main Press Bonding Machine

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