1.Usage: electrical, automotive 2.Size: Virgulate, Ingot, Powder 3.Sn (Min): 99.9% 4.Color:Slivery 5.Advantages:Price cheap
1.Specifications:
(1) Grade: Sn99.99 Sn99.95 Sn99.90
(2)Color:silver
Our tin ingot with Sn 99.9, Sn 99.95, Sn 99.997, Sn 99.99 and also can supply you as your reqeust.
High Purity Tin: Sn-05 Grade 99.999. The content of Tin is above 99.999%. The total content of AG, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni & Pb is bellow 10 ppm; Uitra Purity Tin: Sn-06 Grade 99.9999. The content of Tin is above 99.9999%. The total content of AG, Al, Au, Ca, Co, Cu, Fe, Mg Ni & Zn is bellow 1 ppm.
Grade | Sn%nin | Chemical composition | |||||||||
Impurity content max% | |||||||||||
As | Fe | Cu | Pb | Bi | Sb | Cd | Zn | Al | Total | ||
Sn99.90 | 99.90 | 0.008 | 0.007 | 0.008 | 0.040 | 0.015 | 0.020 | 0.0008 | 0.001 | 0.001 | 0.10 |
Sn99.95 | 99.95 | 0.003 | 0.004 | 0.004 | 0.010 | 0.006 | 0.014 | 0.0005 | 0.0008 | 0.0008 | 0.05. |
Sn99.99 | 99.99 | 0.0005 | 0.0025 | 0.0005 | 0.0035 | 0.0025 | 0.002 | 0.0003 | 0.0005 | 0.0005 | 0.010 |
2.Features: 1. Excellent weldability, good infiltration 2. Clean, beautiful. After welding, insulation, high resistance, low ionic contamination, PCB board welding residual minimal. 3. Good oxidation resistance, low tin slag and cost savings. 4. Solder joint is bright, full and uniform. 5. Economical and can produce the lowest consumption of the solid solder joints. 6. Our tin ingot Quality assurance: test report 7. Good service and timely shippment
3.Packing Form:shrink wrapped+carton+pallet to resist moisture, quake,and corrosion.
4.Usage: It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor. Can be used as coating material, in food, machinery, electrical, automotive, aerospace and also has a widly used in other industrial department . In the float glass production, molten glass float on the surface of molten pool cooling curing.
5.Pictures Show:
High Pure Tin Ingot
