Item

Specifications

Material

FR-4, FR-1, CEM-1, CEM-3, FR-4 Halogen Free, Aluminium ect.

Layer

1-32

Board Thickness

0.4mm-3.2mm

Copper Thickness

0.5oz, 1.0oz, 1.5oz, 2oz, 3oz

Min.Drilled hole size

0.2mm

Min. Track width/space

4/4mil(0.1/0.1mm)

Surface Finish

HASL, Lead free HASL, OSP, Gold-plating, Chemical silver, Chemical gold(ENIG), Chemical tin, Carbon ink.

Solder Mask Color

Green, yellow, black, white, red, blue

Profiling

Punching, Routing, V-cut, Golden finger, Beveling

V-cut Angle

20, 25, 30, 45 degree

Beveling Angle

20, 25, 30, 45 degree

Max Working Panel

24*20 (610mm*508mm)

E-test Voltage

50-300V

Certificate

UL, ISO9001, ISO14001, ISO/TS 16949 ,SGS

Impedance Control

Microstrip impedance: 50-60Ω, Tolerance: +-10%

Differential Impedance: 90-120Ω, Tolerance: +-10%

Quality Standard

IPC-A-600F

Packing

Vacuum packing, in cartons

Terms of payment

T/T ,L/C or Western union