leadframe made of 0.25 mm thick copper C194, silver plated
Main technologies:
Photochemical etching, stamping, silver plated
Base material:
Kovar, nickel-iron alloys, copper alloys, and pure nickel
Material thickness:
From 0.03 mm to 1 mm , with features as small as 0.10 mm on 0.254 mm centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.
Surface treatment:
Silver, nickel, gold, or tin plated entirety or selectively.
Applications:
Semiconductors and relays, and are also used in medical applications.
Julid manufactures high-density lead frames with acute profiles and ultra-fine pitches, allowing for high pin counts. Single- or double-sided lead frames can be etched without incurring the stresses associated with typical machining methods. Dimensions can be held to extremely tight tolerances, with no burrs or other surface irregularities.
copper leadframe
