printed circuit boards good quality,best price.
Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. | 1 - 12 Layers |
Board thickness | 0.015"(0.4mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.5OZ - 3OZ |
Impedance Control | ±10% |
Warpage | 0.075%-1.5% |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
Min Trace Width (a) | 0.005"(0.125mm) |
Min Space Width (b) | 0.005"(0.125mm) |
Min Annular Ring | 0.005"(0.125mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Regesiter torlerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Soldermask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Aspect Ratio | 06:01 |
Hole Registration | 0.004"(0.1mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion Tin, OSP, |
Certificate | ROHS ISO9001:2008 TS16949 SGS UL |
Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
Delivery Time:
Layers | Sample | First Order | Repeat Order |
Single side | 3 days | 7 days | 6 days |
Double side | 4 days | 8 days | 7 days |
4 Layer | 7 days | 9 days | 8 days |
6 Layer | 8 days | 10 days | 9 days |
8 Layer | 10 days | 12 days | 10 days |
10 Layer | 12 days | 14 days | 12 days |
Alu-base | 3 days | 8 days | 7 days |
printed circuit boards
