Detailed Product Description
Backing plate
One of the most important process in sputtering is to ensure the target and the backing plate is bonded soundly to provide maximum thermal conductivity and mechanical strength. A properly bonded sputtering target will normally give a longer working life than a non-bonded target, may enhance the efficiency to achieve faster sputtering rates and will enable thin film coefficient meet the requirement exactly.
In order to meet sputtering requirement, NEXTECK offers both backing plates and bonding services. We can provide a full range of sputtering target backing plates according to either a given equipment specification or customized requirement. And we are able to apply our specialized bonding methods below to bond the sputtering target and backing plate supplied from both of us in a state-of-the-art level.
Bonding Methods:
1. Thin Film Metallization
2. Explosive Bonding
3. Diffusion Bonding
4. Epoxy
Backing Plate Material: Cu/Al/Ti/Mo/Stainless steel/Ceramic etc.
Bonding Size: 2,000 × 1,500 mm
Turnaround Time: 1-3 days
Bonding Integrity: More than 95% coverage
