Encapsulation Resin 1.easily used, 2.high cohesive force, 3.goodinsulation property, 4.good heat resistance
Encapsulation Resin
1. made from epoxy resin, filler and accessory ingredient etc.
2. Its thermal class is B(130).
3.Technical Data sheet(according to the Rota Group Company standard Q/R 101-2006)
Item | Properties | Testing method | unit | Standard values |
1 | Appearance |
| Part A transparent Part B brown transparent | |
2 | Harden time | 23±2 | h | ≤ 10 |
3 | Elasticity | 130±2 |
| indehiscent |
4 | Volatile Content in solid | 10g sample in 45mm×45mm×25mm aluminum dish,130±2, 3h |
| ≤ 2 |
5 | Volumn resistivity | At room temperature | Ω.m | 1.0×10 13 |
in water | 1.0×1013 | |||
130±2 | 1.0×1012 | |||
6 | Dielectric strength | At room temperature | MV/m | ≥ 20 |
in water | ≥ 20 | |||
7 | Pot life | 23±2 | h | ≥ 1 |
Epoxy Encapsulation Resin R-990