1.Original factory 2.2 independent heaters 3.For various BGA chips 4.DH-T1 BGA reballing system
DH-T1 BGA reballing system
Specifications
Similar to reflow oven, fully meet the requirements of ISO-9000. Micro computer control, easy to operate on the platform.
Features
Main performance:
1. Similar to reflow oven, fully meet the requirements of ISO-9000.
2. Micro computer control, easy to operate on the platform.
3. Multi-safety protection.
Main specifications:
1. Heating area: 120MM×200MM
2. Power consumption: 600W
3. Power supply: AC220V
4. Dimension: 310MM×280MM×145MM(L×W×H)
5. Weight: About 7.5Kg
Packing Demension: 34*31*21CM(L*W*H)
Gross Wight: 9KG
DH-T1 BGA reballing system
