1. Movable heating head 2.Color optical system 3.Color LCD Monitor 4.Touch screen interface 5.different hot nozzle equipped
Features
1. Air flow and temperature is adjustable in a wide range to form high temperature breeze
2. The movable heating head is easy to operate, hot air head and mounting head are manually controlled, PCB sliding rack is micro-adjustable with X and Y axis
3. Color optical system with functions such as split vision, zoom in and micro-adjustment, autofocus and menu operation, and with aberration detecting device, with auto focus and software operation function
4. Color LCD Monitor
5. Touch screen interface, PLC control, able to display temperature curves and two detecting curves at the same time
6. Two independent heating areas , temperature and time are digital displayed.
7. The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area.
8. Suction force of the built-in vacuum pump is adjustable, 360 degree rotation in Φ angle , mounting nozzle is micro-adjustable
9. Over-heating protection for the upper hot air heating head
10. Large IR preheating from the bottom, made of imported heater, will heat the PCB evenly to avoid deformation and keep solder effect, heating board is independent controlled
11. Equipped with different alloy hot air nozzles (customizable), easy to replace.
Specification
Machine dimension | 780 x 850 x 950 mm, L x W x H |
Weight | 150KG |
Power | AC single-phase 220V 50/60Hz |
PCB Size | 20 x 20 to 450 x 400 mm |
PCB Thickness | 0.5 to 4.0mm |
Upper heater | 1000W, hot air |
Bottom heater | 1000W, hot air |
Bottom IR Pre-heater | 3600W |
Size of chip applicable | 1 x 1 to 80 x 80 mm |
Mini gap | 0.15 mm |
Mount precision | ±0.01 mm |
Max weight of BGA | 300g |
Temp control | K type Thermocouple , closed-loop control |
Adjustment of workstation | ±10 mm forward/backward and right/left |
More detailed picture
Upper heating
Down heating
Silideway
Mounting nozzle parts
BGA Rework station
