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New model SV560 High alignment vision system Bga rework station for laptop motherboard
New model SV560 High alignment vision system Bga rework station for laptop motherboard

BGA/IC/CPU rework(SV560) Semi-auto machine Auto soldering and desoldering PLC control, optical syste

(SV560) BGA/IC/GPU  Repair Station for laptop motherboard

Specifications: (SV560)

PCB dimension

W20*20~500*550mm

PCB thickness

0.5~2.5mm

Working table adjustment

+/-120mmforward/backward,+/-80mm left/right

Temperature control

K-type thermocouple, close cycle controlled

PCB locating

Outer

Upper heater

Hot gas 1200w

Lower heater

Hot gas 800w

Bottom preheat

Far infrared 3600w

Power supply

Single-phase 220,50/60Hz. 5.5kw

BGA dimension

1*1~70*70mm

Min pitch of BGA ball

0.15mm

Placement precision

0.01mm

Max BGA weight

300g

Machine dimension

L850*W750*H630mm

Machine weight

Approx. 80kg

New model SV560 High alignment vision system Bga rework station for laptop motherboard

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