BGA/IC/CPU rework(SV560) Semi-auto machine Auto soldering and desoldering PLC control, optical syste
(SV560) BGA/IC/GPU Repair Station for laptop motherboard
Specifications: (SV560) | |
PCB dimension | W20*20~500*550mm |
PCB thickness | 0.5~2.5mm |
Working table adjustment | +/-120mmforward/backward,+/-80mm left/right |
Temperature control | K-type thermocouple, close cycle controlled |
PCB locating | Outer |
Upper heater | Hot gas 1200w |
Lower heater | Hot gas 800w |
Bottom preheat | Far infrared 3600w |
Power supply | Single-phase 220,50/60Hz. 5.5kw |
BGA dimension | 1*1~70*70mm |
Min pitch of BGA ball | 0.15mm |
Placement precision | 0.01mm |
Max BGA weight | 300g |
Machine dimension | L850*W750*H630mm |
Machine weight | Approx. 80kg |
New model SV560 High alignment vision system Bga rework station for laptop motherboard