Plasma enhanced chemical vapor deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a of the reacting gases. The plasma is generally created by () frequency or discharge between two electrodes, the space between which is filled with the reacting gases.

MTI provides customized PECVD system for thin film materials lab at reliable quality and affordable price. 

Picture shown above is PECVD with 500V AC Plasma source with OTF1200X60 Split furnace and seven Channels Precision Mass Flowmeter with gas mixing tank and Vacuum system on a mobile cart

If you have any need for PECVD, please provide you requirement, MTIwill help you build up system at the lowest cost