2D non-contact Solder Paste Inspection System YL-881

FEATURES

*All operations are easy and using Windows interface in Chinese/English version.*Survey thickness of tin solder by auto matica lly or manually.*Survey the length and width manually,and the gap of tin solder.*Calculate the measure of area, the measure of cross-section and the measure of volumn *automatically.*All surveyed values can be recorded to a file and be printed to a report.*Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.*Calculate man facture ability degree automatically(CP, CPK, CPM)*It can have proprietary record according to every different production ling.*It can adjust focus point in different thickness of PC boards.*It can be called to sample periodically. 

APPLECATION

*Get the results of statistics and analysis about all surveyed values in every thickness degree.*Inspect the quality of solder printing process.*Survey the thickness benignancy of tin solder*Measure the dimension of tin solder*Provide thickness and dimension measurement function for other objects

FUNCTION

*Surveying the thickness of printing tin solder, length ,height and interval.

*Provide the references of thickness distribution values.*Provide the analysis of different measure of cross-section.*Calculate the measure of area and volumn automatically in object which to be surveyed.*Provide all diagrams of statistics and analysis.  Provide X control Diagram, R Control Diagram  and Thickness List Diagram. Provide X Average  Control Diagram, Single Point List Diagram  

non-contact Solder Paste Inspection System