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Uni-Body Packages
Uni-Body Packages

Hermetic housings Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating.

Hermetic housings

Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.

Material:4J29(FeNiCo)  alloy.Surface plating:Ni/Au plating,selective Au plating.

Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.

Uni-Body Packages

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