Guangzhou Weihengkang Electronic Technology Co., Ltd. [China]

Thermal coupling of electrical/electronic devices to heat sinks

Primary Use:Thermal coupling of electrical/electronic devices to heat sinks

Specal properties:High conductivity;Low bleed;Stable at high temperatures

Type:silicone fluid

Thermal Resistance:<0.06oC

Physical From:Grease-like

Thermal Conductivity:>1.05W/m-k

N.W.5 gram

Color:White opaque

Dielectric Breakdown:>5.0 KV ac

CPU Heat sink Compounds-06