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Dimethylaminomethylphenol EPOXY RESIN
Dimethylaminomethylphenol EPOXY RESIN

1) Reduced reactivity variant of JD K54 2) Low viscosity

JD DMP-10 curing agent is a technical grade of dimethylaminomethylphenol. It is similar to JD K54 curing agent in its behavior as a catalyst, but is less reactive. Blends of JD DMP-10 and JD K54 curing agents provide intermediate reactivity.

 

APPLICATIONS

• Cure catalyst in adhesives

• Accelerator for polyamide or amidoamine curing agents in coatings, castings, adhesives and civil engineering

• Catalyst for anhydride cures in castings and laminates

• Catalyst for epoxy/polysulfide cures

 

Recommended Use Level (phr)

with liquid resin                     5-15

as an accelerator                   1-.10

as a catalyst for anhydride, phenol and acid curing agents       0.5-2

as a catalyst for epoxy/polysulfide or polymercaptan cures       5-15

 

Dimethylaminomethylphenol EPOXY RESIN

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