Surface processing type

HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn)

Layers

single-sided,double-sided

Min trace width

6mil

Min space width

6mil

Min trace to pad/pad to pad space

6mil

Min drill diameter

0.2mm

Min via pad

0.6mm

Max board size

560mmX720mm

Molding board thickness

0.6-3.00mm

Min solder mask dam

6mil

Min solder mask clearance

1.5mil

Min solder mask thickness

10um

Solder mask type

Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue.

Min silk legend width

6mil

Min silk legend height

25mil

Silk legend color

White/ yellow /black

Data file format

GERBER file and corresponding drilling file,PROTEL series,PADS2000,POWERPCB series,ODB++Gerber file and Corresponding Broach file, PROTEL series,PADS2000,POWERPCB series, ODB++

Electricity performance testing Electricity performance testing

100% electrical performance testing,high pressure testing100%electricity performance testing, high-pressure testing

Various types base material to PCB processing

High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3)

Other testing request

Impendence testing, Hole resistance testing, gold slice up, Solder ability.