Detailed Product Description

UV Laser marking machine:

Suit to mark on the surface of glass-polymer material and the others, tiny hole processing

Food and medicine packing material marking,drilling tiny hole(hole diameter d≤10μm)

Soft PCB marking and slicing.

Metal and nometal thin film removal.
Silicon wafer tiny hole and dead hole processing.

Specifications of UV laser marking machine:

laser power: 1W 3W 5W 8W
Marking area50×50mm100×100mm
Min.Character size: 0.2mm
marking speed: ≤7000mm/s
Min. line width: 0.01mm
Repeat accuracy: ±0.003mm
cooling system: high accuracy, constant temperature/ circle chiller