Laser Cutter: 1.Semiconductor Laser 2.Micro-precision mark for small part 3.High energy impulse laser to mark
Features
CY-JQ adopt advanced imported Fiber laser generator, with extra-high exchange efficiency for electronic and light It is integrative design, beautiful structure,high output power,good energy stability, simple and convenient operation, reliable performance, wide application and other characteristics.
High reliability,long resistance,high energy exchange,top beam quality,air cooling,low price,easy operation,energy saving and environment friendly.
Application
Widely applied in continuous cutting plates .Especially for three dimensional cutting and thick metal plate cutting.With 10 meters process fiber(extra longest length is 100m),easily control interface.Also can use robot to do three-dimensional work and operation.
Tech Data
Model | CY-JQ |
Rated Laser Output Power | 200-2000W |
Maximal cutting depth(depend on the material) | 0-5mm |
Main Machine Power | 10-15KW |
Laser wavelength | 1064nm |
Maximal Laser Pulse Power | 70J |
Cutting Area | 200mm*300mm |
Minimal cutting Breadth(depend on the material) | 0.3 |
Maximal cutting Speed | 60-400mm/min |
Pulse Breadth | 0.2ms-10ms |
Pulse Frequency | 1-100Hz |
Light Focus Cavity | Combined Gold-Plated Reflector Cavity/Imported ceramic cavity |
Laser Crystal | Nd:YAG |
Collimating Location Way | Red beam indication |
Working Table CNC System | PLC/ 2-axis, IPC(3-axis selective) |
Working Table Moving | 200*100*150mm (selective collocation: z-axis manually) |
Working Voltage | 380V/three-phase/50Hz |
Main Machine Power | 15KW |
Cooling Machine Power | 5P |
Cooling Mode | Outside Water Cooling/Laser dedicated chiller |
Grounding resistance | <1Ω |
Laser Semiconductor Cutting machinery
