Solderless Breadboard 1).4 Terminal Strips, 2520 Tie-point 2).7 Distribution Strips,700 Tie-point 3).4 Binding Posts
SPECIFICATIONS
Contact Resistance: 100mΩmax
Insulator Resistance: 1000Mωmin.@DC 500V
Dielectric withstanding Voltage:AC 500V For 1 minute
Operating Temperature: -20°C–+80°C
Housing Material: ABS
Contact Material: Copper alloy nickel plated
Contact way: Spring clip
Connector Type: Socket
Recycle use
aluminium base board
Socket metal:phosphor bronze/beryllium copper for choice
Terminal Strip:4×630
Distribution Strip:7×100
Binding Posts:4
Plug times: ≥10000 times
Housing size( L*W*H)
23cm*21.8cm*8.35mm
pitch=2.54mm / 0.1''
all material Rohs compliance
3220 Tie-point Solderless Breadboard TCB-208T
