Welcome to ECBAY
LEAD FREE ( Tg 150) FR4 COPPER CLAD LAMINATES SHEETS
LEAD FREE ( Tg 150) FR4 COPPER CLAD LAMINATES SHEETS

1.High thermal performance 2.UV blocking and AOI compatible, so as to increase productivity efficiency;

UV Blocking and AOI compatible, So as to increase productivity efficiency, high thermal performance,TD≥325°C, T288≥5 Min, suitable for lead free process;

Application:

Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment, lead free PCB process ect.;

Technical Data Sheet:

Test Item

Test   Condition

Unit

SPEC

Typical   Value

Tg

DSC

°C

≥150

154.5

 

 

 

 

Peel   strength(1OZ)

288°C,10S

N/mm

≥1.05

1.41

Thermal   Stress

288°C,10S/solder dip

____

>10

60S/   No delamination

 

 

 

 

 

No   Delamination

Flexural   Strength

N/mm2

LW

≥415

570

CW

≥345

465

Flammability

E24/125

____

UL94 V-0

V-0

Surface   Resistivity

After   moisture

≥1. 0×104

6.12×107

Volume   Resistivity

After   moisture

MΩ.cm

≥1.0×106

6.25×108

Dielectric   Constant

1MHz C-24/23/50

____

≤5.4

4.7

Loss   Tangent

1MHz   C-24/23/50

____

≤0.035

0.016

Arc   Resistivity

D-48/50+D-0.5/23

S

≥60

125

Dielectric   Breakdown

D-48/50+D-0.5/23

KV

≥40

57

Moisture   Absorption

D-24/23

%

≤0.5

0.1

Td

Weight   loss 5%

°C

≥325

348

CTE

Z—axis

Alpha   1

TMA

ppm/°C

≤60

55

Alpha   2

ppm/°C

≤300

276

50-260°C

%

≤3.5

43.3

T288

 

TMA

min

≥5

35

CTI

IEC60112   Method

V

175~250

200

Specimen Thickness: 1.6mm

  CCL thickness and tolerance list

Standard thickness(mm)

tolerance(mm)

Class B/L

Class C/M

0.025~0.119

±0.018

±0.013

0.120~0.164

±0.025

±0.018

0.165~0.299

±0.038

±0.025

0.300~0.499

±0.050

±0.038

0.500~0.785

±0.064

±0.050

0.786~1.039

±0.100

±0.075

1.040~1.674

±0.130

±0.075

1.675~2.564

±0.180

±0.100

2.565~3.579

±0.230

±0.130

3.580~6.350

±3.00

±0.150

Commonly, we will accept the order from according to the Class B,L ,the Class C/M or other special tolerance could be available upon request.

Class B,C figure the dielectric thickness;Class L/M figures the thickness.

R&D Center:

Inspection Instrument:

Flow Chart:

Raw Material:

Production Line:

Packing and Warehouse:

Certificates:

LEAD FREE ( Tg 150) FR4 COPPER CLAD LAMINATES SHEETS

Verified Information This information is Verified by TÜV Rheinland and validity period is 2012/10/29 --- 2013/10/29 All the information below may covers both Gold Supplier and its related companies , Their Relationship will be affirmed according to china laws and regulations , also it will be clearly display in the full report >> Production Capacity: Product line name Production Line Capacity Actual Units Produced(Previous Year)
Insulation Materials Product Line Copper-clad Laminate 145,000 Pieces / Month, Insulation Board 66,000 Pieces / Month, Halogen-free Board 35,000 Pieces / Month, Machined Parts 50,000 Pieces / Month Copper-clad Laminate 1,450,000 Pieces, Insulation Board 660,000 Pieces, Halogen-free Board 390,000 Pieces, Machined Parts 500,000 Pieces
Export Market Distribution: Market Revenue(Previous Year) Total Revenue (%)
North America USD 893,447 1.45
Southeast Asia USD 1,786,894 2.9
Western Europe USD 1,191,263 1.94
South Asia USD 2,084,710 3.39
Domestic Market USD 55,555,556 90.32
Production Machinery: Machine Name Brand & Model No. Quantity Number of Year(s) Used Condition
Vacuum Hot Press Set Weidi & ZFR 1 3.0 Acceptable
Shearing Machine Shanghai & QF11-3X1300 6 5.0 Acceptable
Gluing Machine Xi an Hangtian & SJL-24 3 5.0 Acceptable
FVL-A L6 3 3.0 Acceptable
Turning Spur Anpu 3 5.0 Acceptable
Dosing Machine Xian 1 5.0 Acceptable
Testing Machinery: Machine Name Brand & Model No. Quantity Number of Year(s) Used Condition
Muffle Furnace Chongming 1 5.0 Acceptable
Copper Foil Resistance to Peel Strength Tester Meiya & PST 1 5.0 Acceptable
Halogen Tester Daojin & EDX-GP 1 5.0 Acceptable
Gelation-time Tester Meiya & GT 3 5.0 Acceptable
Liquidity Experiment Sampling Die Machine Maiya & RF-P2 1 3.0 Acceptable
Long Arm Thickness Measuring Instrument Meiya 2 5.0 Acceptable
Production Flow: 0.Inspection 1 1.Raw Inspection 2.Gluing 5.Cutting 1 6.Pressing 7.Cutting 2 8.Laminating 9.Surface Inspection 10.Thickness Inspection 11.Cutting 3 12.Packing 1 13.Packing 2 14.Packing 3 15.Performance Inspection 43.Inspection 2 Testing Report: Report Picture Report Name Report By Product Name & Model No. Report Date
Test Report Centre Testing International Copper-clad laminate & FR-4 2012/05/15
Test Report Centre Testing International Halogen-Free Boards & FR-4 2011/11/08
Test Report Centre Testing International Halogen-Free Boards & FR-4 2011/11/25
Test Report Centre Testing International Insulation Board & FR-4 2012/05/15
Test Report Centre Testing International CEM-3copper-clad laminate & CEM-3 2012/08/18

Ads by Google


About Us | Contact Us | Help | Terms & Conditions
Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0-9
Copyright Notice @ 2008-2022 ECBAY Limited and/or its subsidiaries and licensors. All rights reserved.