Thermal Interface Materials Thermally Conductive PCB Materials Thermoelectric Assemblies Liquid Cooling Systems,Modules Thermal Gap Filler Pads for Any Solution
Laird Technologies’ thermal gap filler pads deliver engineers and designers the most dimensional tolerance by conforming to surface irregularities and replacing air with a much higher thermal conductivity material; increasing the heat transfer and allowing the component to run cooler. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs that continue to pack more power into smaller spaces. These thermal gap filler pad products are used in many applications such as notebook computers, mass storage devices, and audio and video components
Tflex™ 200 V0 Series Gap Filler MaterialTflex™ 200T V0 Series Gap Filler Material
Tflex™ HR200 Series Gap Filler Material
Tflex™ 300 Series Gap Filler Material Tflex™ 300TG Series Gap Filler Material
Tflex™ HR400 Series Gap Filler Material
Tflex™ XS400 Series Gap Filler Material
Tflex™ 500 Series Gap Filler Material
Tflex™ 600 Series Gap Filler Material
Tflex™ HR600 Series Gap Filler Material Tflex™ SF600 Series Gap Filler Material
Tflex™ SF600 DF Series Gap Filler Material
Tflex™ 700 Series Gap Filler Material
Tpli™ 200 Series Gap Filler Material
Tputty™ 502 Series Gap Filler Material
Tputty 504™ Series Gap Filler Material Tputty 506™ Series Gap Filler Material
Gap Filler Product Line Specification Sheet
Laird Thermal Gap Filler Pad TIMs
