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TP080 thermal pad or thermal gap filler pad/thermal conductive pad
TP080 thermal pad or thermal gap filler pad/thermal conductive pad

The largest developer and manufacturer of high thermal conductive pad,LED lighting thermal pad,thermal conductive insulator pad

silicone thermal pad/thermal gap filler pad/thermal conductive pad Typical Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc

- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Specification Sheet:

Typical Properties of TP080

PropertiesUnitsTP080Test Method
Construction & Composition ----Silicone & Ceramic filled----
Color ----GrayVisual
Thickness Rangemm0.5~12.0----
Hardness Shore C18ASTM D2240
Density g/cc2ASTM D792
Tensile Strength KN/m1.3ASTM D412
Elongation %1.35ASTM D412
Continuous Use Temp  -40 to 150EN344
Breakdown Voltage Kv/mm≥4.0ASTM D149
Volume Impedanceohm-cm1.7*1016ASTM D257
Dielectric Constant1MHz4.51ASTM D150
Weight Daminify ----≤1@150 240H
Flame Rating----V-0UL 94
Thermal Conductivity W/m.k0.8ASTM E1461
UL, RoHS, REACH----Compliance----

TP080 thermal pad or thermal gap filler pad/thermal conductive pad

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