FPC
1.UL,ISO, SGS approval 2 quick sample delivery 3.good quality with suitable price 4.single-side, multi-layer, rigid-FPC
| SPECIFICATION | |
| CAPBILITY-FPC 1 | |
| Material Used | Polyimide, Polyester |
| Maximum Panel Size | 19.7"x24(500x610mm) |
| Line width & Spacing | 3mil(0.075mm) |
| Copper thickness | 1/3oz Min |
| Layer to Layer Registration | ±5mil(0.13mm) |
| Minimum Drill hole Dia | 8mil(0.2mm) |
| Minimum Via Size | 4mil(0.1mm) |
| Lands/Pads | 20mil(0.5mm) |
| Capability-FPC 2 | |
| Hard Gold/Immersion Gold | |
| Surface Finish | HAL for Lead Free |
| Tin Plating | |
| Capability-FPC 3 | |
| Cover layer | Polyimide, Flexible Solder Mask |
| Stiffener material | Polyimide, Polyester, FR4, Metal |
| Shielding material | Copperfoil, Silver foil, Silver Paste |
| Assembly on FPC (Through-hole and SMT) | 0201components, 0.4mm pitch IC& connector |
In the continuous pursuit of high flexual resistance, great progress has been made. With the high combination of technology, the very small conjunction conducted by FPC can made better use of space, attaining the higher accurate point, and contributes for the development of electroniccs. It has been widely used in the elelctronic products, such as: mobile phone, camera, computer, LCD atc.
FPC
