BGA rework station * 3 heaters, * Industrial computer system * with USB port * suitable for laptop repair

BGA Rework Station---- SP360C

Specification:

Max PCB size:	430mmX350mm
Min PCB size:	20mmX20mm
Max BGA size:	55mmX55mm
Min BGA size:	7mmX7mm
Max BGA weight:	80g
Power for operation:	3600W
Upper hot air heater	800W
Lower hot air heater	800W
Bottom IR heater:	2000W
Machine dimension:	650*500*600mm
Machine weight:	36KG
Power supply:	AC singal-phase220V 3.6KW

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Description

Units and Pictures (what you see what you get) Nozzles × 5pc(44,38,34,31,28mm,1pcs for each size) Tools box × 1pcs Inside the hexangular wrench × 1set Clamp for Motherbord × 1set Brush × 1pcs USB mouse × 1pcs Vacumm IC pikcer × 1pcs Aluminium plate for BGA IC reballing × 1pcs Thermo sensor wire(High precision) × 1pcs English manual × 1pcs 

acessories of each machine included:

 How to reballing:

Our company:

 

Shuttle star SP360C IR and hot air heater BGA QFP rework station