Infrared BGA rework station BGA800
Beijing Torch S&T Co., Ltd. [China]
Detailed Product Description
Technology parameters:
input voltage | AC220V 50/60Hz 10A |
total power | 1100W |
bottom heating power/ the highest temperature | 600W/450 |
bottom preheating area | 200*200MM |
top heating power/the highest temperature | 500W/400 |
temperature feedback | RTD sensor, closed loop controlling |
max size of chips | 70mm×70mm |
min size of chips | 5mm×5mm |
max weight of chips | 55g |
max size of PCB | 400mm×400mm |
max thickness of PCB | 3-6mm |
Application | BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF,BCC |
Dimension | 400×350 ×410mm |
Weight | About 10 KGS |