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Infrared BGA rework station BGA800
Infrared BGA rework station BGA800

Detailed Product Description


Technology parameters: 

input voltage

AC220V   50/60Hz  10A

total power

1100W

bottom heating power/ the highest temperature

600W/450

bottom preheating area

200*200MM

top heating power/the highest temperature

500W/400

temperature feedback

RTD sensor, closed loop controlling

max size of chips

70mm×70mm

min size of chips

5mm×5mm

max weight of chips

55g

max size of PCB

400mm×400mm

max thickness of PCB

3-6mm

Application

BGA, CSP, LGA( Land Grid Array), Micro SMD,MLF,BCC

Dimension

400×350 ×410mm

Weight

About 10 KGS

 

 

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