Gold bonding wire for LED packing and IC packing
Functions primarily as a connecting material for chip and external circuit, widely used in LED packaging and IC packaging.
Features of products:
1. high purity:Au 99.99%
2.diameter:
| mm | 0.014 | 0.015 | 0.016 | 0.017 | 0.018 | 0.019 | 0.02 | 0.023 | 0.024 | 0.025 | 0.028 | 0.03 | 0.032 | 0.033 | 0.038 |
| mil | 0.05 | 0.6 | 0.6 | 0.65 | 0.7 | 0.75 | 0.8 | 0.9 | 0.95 | 1 | 1.1 | 1.2 | 1.25 | 1.3 | 1.4 |
3.elongation:2%-14%
4. advanced production and testing equipment
5. strict quality control
6. fine after-sale service
Gold bonding wire for LED packing and IC packing
