Parts for power semiconductor devices Got ISO 9001 ISO 14001 OHSAS 18001 OEM service Export to USA,Germany,and so on.

 With the complete products specifications and the good reputation, our company has become one of the most famous manufacturers in China. Our leading products keep the pace with the development of the most sophisticated ones in the world, and the principal technical specifications have achieved the advanced world standards. We have the production capability of 600,000 sets per year.

Specifications

Technical

Leak rate, ≤1×1,0-9 Pam3/sFlatness of copper surface,≤0.005mmParallelism between copper surfaces,≤0.03mmConcentricity between flange and copper,≤0.5mmPull test,≥5KN/cm2Temperature cycling,-65°C~200°C 5 circlesPlating thickness,2-7μ

Main material

Ceramic,93.5%min AL2O3Glaze,Color white ,T ≥14 0°CFlange,TU1(OFHC·Cu)or Ni42Fe58 AlloyCopper contact,TU1(OFHC·Cu)Solder,Ag72Cu28 AlloyGate tube,TU1(OFHC·Cu)or Ni42Fe58 Alloy

The extra thin Ceramic Packages for power semiconductors