SMD Hot Air Rework Station 1.Buid-in pump,even hot air distribution 2.Remove SOIC,QFP,PLCC,BGA,SMC chips easily
SBK858 Most Cost Effective/Lowest Price Ever SMD/ESD New product Hot Air Rework Station
Product Description
Suitable for SOIC, QFP, PLCC, BGA, SMC and temperature-sensitive components. Work great for desoldering surface mount components in the circuit board of mobile phone. Suitable for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating etc.
Features
♦ Hot air temperature and volume adjustable,ideal for QFP,SOP,PLLCC and SOJ chips removing.
♦ Built-in sensor ensures stable temperature output
♦ Pulses heating method,protect heating element,hot air blower from overheating,thus prolongs the machine's service life.
♦ ESD safe design,no damage will caused to sensitive components
♦ Automatic cool off system,protect the heater from overheating.
♦ Intelligent air volume and temp. saving function available
♦ When not in use,auto cooling mode will be initiated by putting handle on the stand
Specifications
Input Voltage | AC220V 50HZ/AC110V 60HZ |
Temp. Range | 100~450°C |
Max.Power Rating | 700W |
Air Blowing Device | build-in pump |
Air Flow | 23L/Min |
Dimensions | (L)160x(W)95x(H)141mm |
Length of the cord | 1.2m |
Heating Element | BK853 |
Nozzle C/W machine | A1124,A1130 |
Replacements
Heating element Nozzle Hot air blower handle
Company information
HOT AIR REWORK STATION