Detailed Product Description
In order to adapt the environmental protection request, our factory invests a huge amount money to produce leadless soldering tin which passed SGS environmental protection attestation a few years ago, the product standard are all in readiness, the usage function is nice. Lichuang Soldering Tin Manufacturing Company insists on business principles of "quality first, sincere supreme", taking innovation to decline the cost for customer, which is an excellent electronics industry cooperation buddy. Lead-Free solders is the necessary processing material in Surface Mount Technology industry. It is widely weleing in SMT and DIP. Only if you used Tin Furnace, Electric Iron and wave Soldering Machine, Lead-free solder is necessary. The characteristics is Special recommendation: Low cost, Sn-0.7Cumelting point 227centigrade, operating temperature, 260centigrade, certigrate, good oxidation resistance, solderable, good thermal fatigue reliability, spot bright. Mainly used in manual soldering or wave soldering.
ProcessThe recommended manual soldering processes are as follows: rapidly use the heated and tinned welding head to touch the core tin wire, and then touch the welding point where the melted tin can facilitate the initial thermal conduction from the soldering iron to the workpiece. Then remove the tin wire from the welding head which is to touch the soldering surface. It is also recommended by other experts that the welding head is to contact the pin/soldering plate, and the tin wire is placed between the welding head and the pin to form a thermal bridge, followed by moving the tin wire to another side of the soldering area. Whatever the process, the satisfactory result can be achieved if they are correctly operated.
Tips for manual soldering.
A fixed soldering point requires good tinned welding head with its temperature about 1000C higher than the liquidation temperature of tin solder. The fast thermal conduction of the soldering iron can help improve tin solder on the welding head. The workpiece, good fluidity and wetting need preheating. A good solderable soldering plate, hole and component pin can help form the good soldering point in the shortest time. Under higher temperature, short time is the key to guard against damage to the base board, damage to the joint between the soldering plate and base board, and excessive inter-metal growth. The tin soldering point exposed to the tin and/or base board with its temperature higher than the liquidation temperature of Tg in the temperature cycles may suffer from reliable accumulation degrading. The best method is to complete the soldering point in less than five minutes, three minutes even better. Within this time, all necessary operation should be competed for jointing.
