Detailed Product Description

Suitable for AV accessories, with RoHS compliance
Number of layer: single-layer, double-layer, 4 to 10 layer
Copper thickness: 0.5 to 10-ounce
Laminate material: FR-4, FR-1 and CME-1
Base board thickness: 0.3 to 4.0mm
Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nel plating and gold finger
Twist: 0.5%
Insulation resistance: 10(11)
Test voltage: 150 to 300V
Thermal cycling ability 288C 5 seconds
Finished board area: 560 x 610mm
Minimum line width and spacing: 0.1/0.1mm
Copper thickness in hole: 25.0um
Minimum pad diameter inner layer: 0.5mm
Minimum hole diameter: 0.25mm
Hole tolerance PTH: +0.075mm NPTH: +0.05mm
Hole location tolerance: +0.075mm
Profile tolerance CNC routing: +0.15
Profile tolerance CNC Punching: +0.15
Solder mask bridge ability: 0.1mm
Solder mask rigidity: 6H
Solderable test: 245C 5 second
Inner packing: vacuum packing/plastic packing
Outer packing: standard carton packing