Detailed Product Description
FPC/Printed circuit boards/PCB/PCB Assembly
| info. | Layer: | n/a |
| Material: | polymide | |
| Board finished thickness: | n/a | |
| Surface finish/treatment: | gold plating | |
| Solder mask color: | n/a | |
| Copper | Copper thickness: | n/a |
| Copper thickness in hole: | n/a | |
| Min. | Min.drilled hole size: | n/a |
| Min.line width: | n/a | |
| Min.line spacing: | n/a | |
Shenzhen XiYaNuo Technology Co.,Ltd. | ||
No. | Technics | Technical standard |
1) | Number of Layer | 1-28layers |
2) | Max.Board Size | 450*660mm(18"*26") |
3) | Min Finish Board Thickness | 4 layers 0.4mm/16mil |
6 layers 1.0mm/40mil | ||
8 layers 1.0mm/4mil | ||
4) | Min Line width | 0.075mm 3mil |
5) | Min line space | 0.075mm 3mil |
6) | Min Hole Diameter | 0.1mm 4mil |
7) | Hole wall copper thickness | 0.025mm 1mil |
8) | PTH Hole Dia Tolerance | ±0.10mm 4mil |
9) | Non PTH Hole Dia Tolerance | ±0.05mm 2mil |
10) | Hole location Tolerance | ±0.05mm 2mil |
11) | Profile Tolerance | ±0.10mm 4mil |
12) | Min S/m pitch | 0.10mm 4mil |
13) | Twist and Bent | ≤1.0% |
14) | Insulation Resistance | 10Ω |
15) | Hole Resistance | 300Ω |
16) | Electric Strength | 10A |
17) | Current Breakdown | 1.4N/mm |
18) | Soldermask Abrasion | 6H |
19) | Solderability | 288/20seconds |
20) | self-extinguishing | 94V-0 |
21) | E-test Voltage | 50300V |
22) | Dielectric Strength | 1.3KV/mm |
