SCHOTTKY BARRIER DIODE (CHIP&DEVICE) SBD120 (chip appearance)
Detailed Product Description
| chip size (mm2/mil2) | chip thickness (µm) | bonding pad dimension (mil2) | scribe line width (µm) | top metal | back metal | passivation | wafer size (inch) | Electrical characteristics (Ta=25degC) Forward voltage (Vf)(V) |
| 0.89×0.89 35×35 | 260±20 | 30×30 | ≤80 | Ag or Al | Ag or Au | Si3N4orSiO2 | 4 | 0.44 |
