Guangzhou, Liwan District, Dong Hang Communications Equipment Hong [China]

Detailed Product Description

Model: BK E9160 BGA Paste
Welding materials used.
Solder paste, metal powder.
Sn:    63%
Ag:     8%
Cu:   10%
Flux: 19%
Volume: 50g
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Phone chip repair, computer or home appliance repair path chip BGA-specific products.
Joints full and bright, no cold solder joint, false welding phenomenon.