Tin solder Bar
Detailed Product Description
Lead-Free Tin Solder Bar(Sn Ag Cu)YB0305
Alloy Compostion:
Sn: 96.5% Ag: 3% Cu: 0.5%
Feature:
1. The metal composition are executed by 2.1 alloy components standard.
2. The productis according to the hazardous substance control requirements of EU WEEE and RoHS (For details, please see Hazardous elements contents report by SGS)
Use for:
The specification is applicabale to the soldering of the electronics of relevant electronic elements.
Physical property
Specific alloy | Solid phase tem. () | Liquid phase Tem. | Specific gravity |
Sn96.5/Ag3 / Cu0.5 | 217 | 220 | 7.42 |