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Tin solder Bar
Tin solder Bar

Detailed Product Description


Lead-Free Tin Solder Bar(Sn Ag Cu)YB0305   

Alloy Compostion:

Sn: 96.5%  Ag: 3%  Cu: 0.5%

Feature:

1.       The metal composition are executed by 2.1 alloy components standard.

2.       The productis according to the hazardous substance control requirements of EU WEEE and RoHS (For details, please see Hazardous elements contents report by SGS)

 

Use for:

The specification is applicabale to the soldering of the electronics of relevant electronic elements.

 

Physical property

Specific alloy

Solid phase tem. ()

Liquid phase Tem.

Specific gravity

Sn96.5/Ag3 / Cu0.5

217

220

7.42

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