High Tg PCB General InfoTg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.Also there re a lot of different hi-tg material not listed here, different country, different company prefer using different material. Please view datasheet for each of them to choose most suitable material for you. If without special notice, normally we will use S1170 from SYL.170Tg is also popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you d better use Ceramic boardwhich can go through -55~880C. Please contact us for more information about Hi Tg circuit board.High Tg materials have the following properties:High glass flow temperature value (Tg)High temperature durabilityLong delamination durabilityLow Z axis expansion (CTE)What is high Tg PCB (printed circuit board)In recent years, there are more and more customers request to manufacture PCB with high Tg, in the following we would like to describe what is high Tg PCB.TG means Glass Transition Temperature Temperatures that are associated with long term operations must be considered in the manufactured of printed circuit boards that will be exposed to high thermal loads.. The function of a circuit board will be affected if its temperature exceeds the designated Tg value. You can count on Super PCB for a high TG PCB that won’t fail you.Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 – 140℃, High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB. As the rapid development of electric industry, especially for the computer as the representative of electronic products, developing toward the high performance, high multilayer requires PCB substrate material with higher heat resistance to ensure high reliability. On the other hand, as a result of development of SMT, CMT with high density pcb assembly technology, the PCB manufacturing with small hole size, fine lines and thin thickness are more and more inseparable from the support of high heat resistance.If the Tg of PCB substrate is increased, the heat resistance, moisture resistance, chemical resistance and stability of printed circuit boards will be improved as well. The high Tg applicates more in the lead free pcb manufacturing process. Therefore, the difference between general FR4 and high Tg FR4 is, in the hot state, especially in the heat absorption with moisture, the high Tg PCB substrate will perform better than general FR4 in the aspects of mechanical strength, dimensional stability, adhesiveness, water absorption and thermal decomposition.High Tg refers to the high heat resistance.With the rapid development of electronic industry, especially the electronic products represented by computer, toward high function, high multiple stratification, need PCB substrate material of higher heat resistance is an important guarantee.Represented by SMT, CMT s emergence and development of high density installation technology, make the PCB in the small aperture, fine lines, thin, more and more inseparable from the support substrate, high heat resistance.Commonly so FR - 4 and the difference between high Tg FR - 4: is under the hot, especially in the heat after moisture absorption, its material mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion situations vary, such as high Tg products is significantly better than the ordinary PCB substrate materials.Details Description LayerSingle LayerMaterialFR4Board Thinckness1.2MMSize12*9CMSolder MaskGreenSilkscreenWhiteFinish Copper Thinckness35μm/35μmSurface FinishHASLBoard Thinckness Tolerance±10%Impedance Control±10%Warp & Wist0.70%Testing100% Electric Test, IPC Class II.FR4 - Glass laminates are widely used for subtractive Printed Circuit Board fabrication because of their ability to meet a wide variety of processing conditions. Thermally stable copper-clad epoxy-glass laminates offer high mechanical strength and machinability and outstanding electrical characteristics. Designed for single and double-sided boards, they provide a combination of processing flexibility and finished board performance needed for many SMT applications. HiTg FR4 - A high Tg is very important for the PCBs to guard against barrel cracking and pad fracture during the soldering process. CEM-1 - Composite Epoxy Material is very similar to FR4. Instead of woven glass fabric a "flies" type is used. CEM-1 is a paper-based laminate with one layer of woven glass fabric. It is not suitable for Plated Through Hole. CEM-1 can only be used for single-layer PCB. Board Thickness - Standard base thickness is 0.062".This is how much copper your board will have on its surface. It is the copper foil thickness, plus plated copper, minus surface preparation. It is given in oz / per sq foot. 1 oz = a minimum of 0.0012"- 0.0014" thickness. We offer finished copper of 1oz. up to 4oz. If you need a different finished copper amount, please note your needs in the additional comments section of the request.This is typically green but we also offer blue, red, and black. We also call it LPI, for Liquid Photo-Imagable solder mask, which is the type we use. It keeps the traces from shorting together when the soldering is done. When no soldermask is requested, we coat the areas of the board not covered with optional solder mask with solder. This is a mix of Tin and Lead.High quality PCB prototypes to productionLead free/RoHS PCBs are availableAll boards are UL approvedAll boards are manufactured under IPC-A-600 specifications and guidelinesAffordable pricingOn time deliveryCircuit Board Materials (FR4, HiTg FR4, Cem-1, Polyimide, etc.)Multilayer printed circuit boardsPrototypes to Full Volume ProductionFlexible Printed Circuit BoardsProducts Details Raw Material FR-4 (Tg 130 available) Layer Count Single SidedBoard Thickness 1.2mmCopper Thickness 1.0ozSurface Finish ENIG(Electroless Nickel Immersion Gold)Solder Mask GreenSilkscreen WhiteMin. Trace Width/Spacing 0.075/0.075mmMin. Hole Size 0.25mmHole Wall Copper Thickness ≥20μmMeasurement 300×400mmPackaging Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double strapsApplication Communication,automobile,cell,computer,medicalAdvantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,Special Requirements Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are AcceptableCertification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREEHigh Tg PCB General InfoTg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.Also there re a lot of different hi-tg material not listed here, different country, different company prefer using different material. Please view datasheet for each of them to choose most suitable material for you. If without special notice, normally we will use S1170 from SYL.170Tg is also popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you d better use Ceramic boardwhich can go through -55~880C. Please contact us for more information about Hi Tg circuit board.High Tg materials have the following properties:High glass flow temperature value (Tg)High temperature durabilityLong delamination durabilityLow Z axis expansion (CTE)What is high Tg PCB (printed circuit board) In recent years, there are more and more customers request to manufacture PCB with high Tg, in the following we would like to describe what is high Tg PCB.TG means Glass Transition Temperature Temperatures that are associated with long term operations must be considered in the manufactured of printed circuit boards that will be exposed to high thermal loads.. The function of a circuit board will be affected if its temperature exceeds the designated Tg value. You can count on Super PCB for a high TG PCB that wont fail you.Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 – 140℃, High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB. As the rapid development of electric industry, especially for the computer as the representative of electronic products, developing toward the high performance, high multilayer requires PCB substrate material with higher heat resistance to ensure high reliability. On the other hand, as a result of development of SMT, CMT with high density pcb assembly technology, the PCB manufacturing with small hole size, fine lines and thin thickness are more and more inseparable from the support of high heat resistance.If the Tg of PCB substrate is increased, the heat resistance, moisture resistance, chemical resistance and stability of printed circuit boards will be improved as well. The high Tg applicates more in the lead free pcb manufacturing process.Therefore, the difference between general FR4 and high Tg FR4 is, in the hot state, especially in the heat absorption with moisture, the high Tg PCB substrate will perform better than general FR4 in the aspects of mechanical strength, dimensional stability, adhesiveness, water absorption and thermal decomposition.High Tg refers to the high heat resistance.With the rapid development of electronic industry, especially the electronic products represented by computer, toward high function, high multiple stratification, need PCB substrate material of higher heat resistance is an important guarantee.Represented by SMT, CMT s emergence and development of high density installation technology, make the PCB in the small aperture, fine lines, thin, more and more inseparable from the support substrate, high heat resistance.Commonly so FR - 4 and the difference between high Tg FR - 4: is under the hot, especially in the heat after moisture absorption, its material mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion situations vary, such as high Tg products is significantly better than the ordinary PCB substrate materials.Products Details Raw Material FR-4 (Tg 180 available) Layer Count 4-LayerBoard Thickness 1.2mmCopper Thickness 3.0ozSurface Finish Immersion Gold (Electroless Nickel Immersion Gold)Solder Mask GreenSilkscreen WhiteMin. Trace Width/Spacing 0.075/0.075mmMin. Hole Size 0.25mmHole Wall Copper Thickness ≥20μmMeasurement 700×400mmPackaging Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double strapsApplication Communication,automobile,cell,computer,medicalAdvantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,Special Requirements Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are AcceptableCertification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE Standard FR-4 Material Properties Performance characteristics Glass Transition Temperature (Tg)150Tg or 170TgDecomposition Temperature (Td)> 325℃Coefficient of Thermal Expansion (CTE)3.0%-3.8%Dielectric Constant (@1 GHz)4.25-4.55Dielectric Constant (@55 GHz)≤5.5Dissipation Factor (@ 1 GHz)0.016Water imbibition (D - 24/23, the thickness of 1.6 mm)≤19mgLaminate thickness0.005"~ 0.125"CombustibilityFV0Density1.70-1.90g／cm³ Vertical Layer To The Bending Strength ANormal :E-1／150,150±5℃≥340MpaParallel To The Floor To The Impact Strength (beam)≥233KJ／mExecution StandardGB/T1303.1-1998After Flooding Insulation ResistanceD-24／23）：≥5.0×108ΩVertical layer to the electric strength (in the middle of 90 + 2 ℃ for transformer oil, thickness 1 mm)≥14.2MV／mParallel layer to the breakdown voltage (90 + 2 ℃ in the transformer oil)≥40KVMaterial TG (DSC,°C) Td (Wt,°C) CTE-z (ppm/°C) Td260 (min) Td288 (min) S1141 (FR4) 175300558/S1000-2M (FR4) 180345456020IT180 180345456020Rogers 4350B 28039050//High TG Materials´Data Compared
