4 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel Format Model Number:XCEPCB001 Shipping port:ShenZhen/HongKong Place of origin:GuangDong,China Delivery Time:3-10 Working Days Production capacity:FR4:2000000Sqms High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,ULMaterial:FR4Soldermask:BlackMolde Number:xcepcb001Silkscreen:WhiteLayer:4Panel Size:175*205mm/6pcsBoard Thickness:1.2mmPackage Details:Inner:Vacuum-packed Bubble bag With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:ENIGSpecial requirement:Impedance Control in 50OhmsResin HoleProvide Slice reportFinished Copper:1ozDelivery Time：6 DaysSpecification:4 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel FormatFR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials. Defined impedance 4 layer black soldermask immersion gold board is: a good laminated structure will be able to play on the printed circuit board characteristic impedance control, the traces can be formed easily controlled and predictable transmission line structure is called impedance plate. Current common characteristic impedance is divided into: single-ended (line) impedance differential (fixed) impedance coplanar impedance.Single-ended (wire) Impedance: English single ended impedance, refers to a single signal line measured impedance.Difference (Fixed) Impedance: English differential impedance, differential drive means to the test in two monospaced equally spaced transmission line impedance.Coplanar impedance: English coplanar impedance, refers to the signal line at around GND / VCC (signal lines to both sides GND / VCC equal spacing) between the test transmission to the impedance. Typical ApplicationsCellular Base Station Antennas and Power AmplifiersMicrowave point to point (P2P) linksAutomotive Radar and Sensorslow dielectric lossBallast, lights, navigationThe stability of the dielectric constantAn extremely low water imbibitionIT industry,Keyboard productsGeneral FR-4 differs from high Tg FR-4: in the hot state, especially in the heat after moisture absorption, the mechanical strength of the material, dimensional stability, adhesion, water absorption, thermal decomposition, differences in thermal expansion and other various conditions, high Tg products significantly better than conventional PCB substrate material. Parameter: oItemData1Layer:1 to 24 layers2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers3Board thickness:0.20mm to 3.4mm4Copper thickness:0.5 OZ to 4 OZ5Copper thickness in hole:>25.0 um (>1mil)6Max. Board Size: (580mm×1200mm)7Min. Drilled Hole Size:4mil(0.1mm)8Min. Line Width:3mil (0.075mm)9Min. Line Spacing:3mil (0.075mm)10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold platingCompetitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB .Specifications TechnologyNotesNumber of Layers1-28 LayersBoard MaterialsFR4 (Tg 135, 145, 170,180)Rogers(RO4350,4003,5880,3003 etc.)Taconic(TLY-5,TLY-3,TLY-8 etc.)Arlon(AD255,AD300,AD250,etc)F4BIsolaArlonTP-2We keep these materials in stock. If you need a material that is not listed here, please contact us and we can order it for you.Final PCB Thickness2 Layer – Min .005" Max .250"4 Layer – Min .015" Max .250"6 Layer – Min .025" Max .250"8 Layer – Min .031" Max .250"10 Layer – Min .040" Max .250"12 Layer – Min .047" Max .250"14 Layer – Min .054" Max .250"16 Layer – Min .062" Max .250"18 Layer – Min .093" Max .250"20 Layer – Min .125" Max .250"22 Layer – Min .125" Max .250">24 Layer – Min .125" Max .250"Core ThicknessMin .0025"Maximum PCB Size2 Layer 20" x 28"Mulitlayer 16" x 26"Minimum Conductor Space0.003"Minimum Conductor Width0.003"Minimum Drill Hole Size0.006"What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:[email protected]:0755-26055813Fax:0755-26055946Skype:karen-xcepcb
