Product DetailsBBIEN LF-05 type7 SAC305 tin silver alloy solder powderType 7 SAC305 powder instructionBBIEN’S LF-05 SAC305(SN96.5Ag3.0Cu0.5)is a lead-free,tin silver copper alloy solder powder designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required.The melting point of SAC305 is 217degree Celsius.Packing with 1kg and 5kg per vacuum bag filled with nitrogen.Availability size of powder:Available type:it is available in Sn96.5Ag3.0Cu0.5 type 3 powder mesh is normally recommended, but type4,type5, type6 and type7 are all skilled and available for this alloy solder paste.BBIEN’S LF-05 SAC305(SN96.5Ag3.0Cu0.5)solder powder is available for fine pitch applications with SnAgCu alloys in a similar melting range to the listed alloys,for specific packaging information.Sn96.5Ag3.0Cu0.5 tin silver solder powder,the following size of powder can be availableSmall variations in composition and the level of impurities can affect wetting properties of the solder paste:oxidation behavior, melting temperatures,flow within the joint and joint strength. The ideal solder composition will feature tight tolerances of alloy compositionBBIEN SAC305 silver solder type7 to type3 powder is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies.Storage,Handling,and Shelf Life:Recommended optimum storage condition for solder powder to maintain consistent viscosity,reflow characteristics,and overall performance.BBIEN’S SAC305 should be stabilized at room temperature prior to printing. BBIEN SAC305 should be kept at standard refrigeration temperatures, 20~28°C.Please contact BBIEN,if you require additional advice with regard to storage and handling of this material.Shelf life is 6months from date of manufacture and held at 20~28°CBBIEN LF-05 SAC305 powder featurePowders are divided into six or senven particle type with the finer powder represented by higher numbers.Table 1 also includes the customary designation of powders by mesh sizes of the sieves used to sort the particles according to ASTM B-214 Test Method1.The welding powder is ball shaped,the dark part is a tin rich area and the light part is a lead rich area.The pictures show the good sphericity,homogenous alloy composition and smooth surface of the product.2.Particle size classification and final typing technology enables stable particle size of the product provided to customers.3.SAC305 type7 silver powder has low oxygen content oxygen content is strictly controlled during production and packing of allalloy welding powder.Leco oxygen determinator is adopted to determine the surface oxygen content and chemical assay is adopted to determine the total oxygen content.4.Advanced powder classification and collection technology enables Type 4-Type 3 alloy welding powder free of powder smaller than 20um.Packing Details:The packing materials can be separated into inner layer vacuum bag and outer package with plastic barrel,so as to better secure for shipping and transportation.SpecificationSn96.5Ag3.0Cu0.5 type7,type6,type5,type4 and type3Appearancegray powderWeight1kg/bag or 5kg/bag;20-25kg/barrel1) BBIEN's solder powder as followSNAlloy BrandSolidus TemperatureLiquidus TemperatureDensity g/cm3Available type size1Sn42Bi581391398.8Type3~type72Sn64Bi35Ag11511728.2Type3~type73Sn64.7Bi35Ag0.3151-152172-1738.1Type3~type74Sn42Bi57.7Ag0.3143-152152-1658.3Type3~type55Sn96.5Ag3.0Cu0.5217210-2207.54Type3~type76Sn99Ag0.3Cu0.7227220-2307.43Type3~type77Sn63Pb37183180-1908.4Type3~type78Sn62Pb36Ag2179170-1838.62Type3~type7Exporte countries:BBIEN SAC305 type7 solder alloy powder have been exported to America, Canada, Taiwan, Hongkong, SouthKorea, Russia,Japan,India…We are appreciated your kindly feedback and inquiries.Products PhotosHealth&Safety:This product,during handling or use,may be hazardous to health or the environment.Read the Material safety Data Sheet and warning label before using this product.Application and Photos:BBIEN’S SAC305 types of solder powder are used in generally making solder paste with flux miture,applied for the assembly of printed circuit boards(PCBs).BBIEN SAC305 type 7 solder powder is also apply for a wide variety of applications,including hand-held electronic devices such as smart phones and tablets,computer motherboards,consumer electronic products,network servers,automotive systems,medical and military equipment and many others.Technical DatasheetBBIEN LF-05 type7 SAC305 tin silver alloy solder powderSpecificationSn96.5-Ag3.0-Cu0.5 type7 and type6 solder powderAppearanceGray/black small size of powder on surfacePackingGeneral 1kg/bag and 5kg/bag foil bag with nitrogen packed-inChemistry componentElements Specification(%)MaxTested result(%WT)Sn96.5±196.596.62Ag3.0±0.53.0Al0.0050.0002As0.0300.0050Sb0.0500.0148BiRemainderRemainderCu0.4~0.60.5Fe0.0100.0003In0.0500.0019Ni0.0100.0007Pb0.0500.0257Cd0.0020.0002Au0.0500.0010Mark:The above concentration of specification are in%weight.Single value listed are the maximum allowable standard.c.Size:5-18micro-50%average size:smaller than 10 micro-Oxygen content:less than 200ppmPurity and chemistry componentSortMelting PointSpec.Gravity g/cm3MPaTensile StrengthSn96.5Ag3.0Cu0.5217℃7.58g/cm368.5Alloy componentMeltingpoint℃SuggestingWorking temperature℃Gravity g/cm3Rigidity HBConduct heatM.S.KExtendMpaExtendrate%Conductivity%Sn96.5Ag3.0Cu0.5217100-3507.58166460-80Above7016.83.Physical featureParticle SizeBBIEN SAC305 alloyed solder powders are available in type 2,type 3 and type 4,type5,type6 and type7 grades.The particle size distributions meet or exceed the J-STD-006 specification shown below table.Other particle size distributions can be provided to meet individual customer's requirements.Grade1%Less Than90%10%Max.Type 3+45 microns25-45 micron(µm)25 microns(µm)Type 4+38 microns20-38 micron(µm)20 microns(µm)Type 5+25 microns15-25 micron(µm)20 microns(µm)Type 6+18 microns10-18 micron(µm)10 microns(µm)Type 7+25 microns5-12 micron(µm)5 microns(µm)Type4~type7<120 ppm micronsStorage and Shelf LifeBBIEN solder powders are packaged to ensure protection from air and moisture.Care must be taken to minimize air and high temperature exposure after opening the package.BBIEN solder powders have a shelf life of 6 months from date of manufacture,for factory sealed bags,stored under room temperature conditions.Test ItemTest ResultTest MethodCopper Plate Corrosion TestPassJIS-Z-3197,8.4.1Spread Test>75%JIS-Z-3197,8.3.1.1Copper Mirror TestPassIPC-TM-650,2.3.32Viscosity Test(25°C,10rpm)220±30 Pa•sJIS-Z-3284.Annex 6Tackiness Test(gf)>130(8hr)JIS-Z-3284.Annex 9Slump TestPassJIS-Z-3284.Annex 7,8Solder Ball TestPassJIS-Z-3284.Annex 11SHENZHEN BBIEN TECHNOLOGY CO.,LTD SAC305 solder powder technicalTest Content----Reliability Test--S.I.R.Test◊>1×109Ω,PassIPC-TM-650,2.6.3.3Electro Migration Test♦PassIPC-TM-650,2.6.14.1Advantage And ServiceBBIEN LF-05 type7 SAC305 tin silver alloy solder powderHigh Ag silver tin copper alloy solder powder SAC305 offers high soldering reliability compared with the Sn-Pb series solder of the past and is available in a wide product lineup according to the required soldering temperature.1) BBIEN solder powder department factory pay high attention to Research and Development,continuous technical innovation for lead free solder paste industry,until now,we accumulate much valuable experience,six three solder powder engineers operate a specialized reflowing solder powder production.2) Due to sophisticated technical in Sn-Ag-Cu alloy,BBIEN can supply the thinnest size of type7 (5~12micron) solder powder for making SAC305 no clean solder paste,normal size such as type6,type5,type4 and type3 are also available.3) Sn-Ag-Cu solder powder LF-05 SAC305(Sn96.5Ag3.0Cu0.5)can be not only applied to tradional electronics pcb,smt reflowing soldering,but also its application for some new hi-tech industry, semiconductor. LED,aerospace, automotive.4) BBIEN's solder powder as followSNAlloy BrandSolidus TemperatureLiquidus TemperatureDensity g/cm3Available type size1Sn42Bi581391398.8Type3~type72Sn64Bi35Ag11511728.2Type3~type73Sn64.7Bi35Ag0.3151-152172-1738.1Type3~type74Sn42Bi57.7Ag0.3143-152152-1658.1Type3~type55Sn96.5Ag3.0Cu0.5217210-2207.54Type3~type76Sn99Ag0.3Cu0.7227220-2307.43Type3~type77Sn63Pb37183180-1908.4Type3~type78Sn62Pb36Ag2179170-1838.62Type3~type7Technical Advantage1) BBIEN can share the datasheet for our product to our clients.2) Some certificate of compliance,SGS,ISO and COA,MSDS,are available.3) BBIEN appreciate our clients and your valuable advice and suggestion,which will make our product and company better and better.4) Both pre-sale and after-sale,BBIEN have skilled person to follow-up our client,reply answer for reasonable price,relevant quality standard,products data informations,shipping for your questions skillfully,quickly,technical support is available.Shipping Advantage1) Mutiple-transportation oversea shipping ways by ari,by sea,by train and truck road way ensuring the shipment can arrive at destination all around the world safety,quickly and efficiently.2) Shipment can be deliveried once placing order 2 to 10 working days.3) Shipment will be regular and normal go through local custom and its warehouse,BBIEN has own specialized shipping team and operators agent all over the world.Service1) When you send us message,BBIEN will feedback you general within 2 working hours.Our customer service or sales person will be match with you above 10-24hours.And solve your problem on solder products.2) OEM is available according to your own logo.Payment way:A variety and flexible of payment terms,T/T,western union,paypal,L/C can be acceptable.
