Electroless Nickel TG180 8 layer pcb board in 1.0mm thickness Printed circuit board concepts and capabilities1.printed circuit board in English: Printed CircuitBoard, Flexible Printed Circuit2. the printed circuit board in English shorthand: PCB, FPC3.The main function of the printed circuit board: supporting components and Interconnect circuit elements that support and interconnect the two effects Xinchenger Electronics co.,Ltd established in 2002,we have commited ourselves to manufacturing various of hi-frequency microwave pcb and multi-layer board including fastest sample production. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality.furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available. Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people. With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.PCB classificationA. In Materiala. Organic MaterialPhenolic resin, glass fiber / epoxy resin, Polyimide (polyimide), BT / Epoxy mused genus. b. an inorganic materialAluminum, Copper-invar (steel) -copper, ceramic (ceramic) mused genus. Main whichever cooling. • Do you have an order minimum?1pc or 1 panel acceptable,also for PCBA. • How to place the order?After we quote for you,and you will accept the price,then we will send proforma invoice to you for payment,also you can contact us by skype.• What kind of transportation we adopt? It'll depand on your choice. Most time we will delivery on DHL or Fedex IP,if you have requirements for the delivery way,we will according to your choice. Company Service:24 hours quick sample is avaliable here.reply Customer's any enquiry within 3 hours;Blind buried hole ,crossed blind hole can be done24 hours Engineering Gerber files treatment.24 hours English Engineering Questions Confirmation by E-mail.Supply the best project fit for production customized Model Number:XCEPCB005 Shipping port:ShenZhen/HongKong Place of origin:GuangDong,China Delivery Time:3-10 Working Days Production capacity:FR4:2000000Sqms High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,ULMaterial:FR4Soldermask:BlackMolde Number:xcepcb005Silkscreen:WhiteLayer:8Panel Size:105*55mmBoard Thickness:1.0mmPackage Details:Inner:Vacuum-packed Bubble bag With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:ENIGSpecial requirement:BGATG180Provide Slice reportFinished Copper:1ozDelivery Time：8 DaysElectroless Nickel TG180 8 layer pcb board BGA stands for Ball Grid Array (PCB ball grid array structure), which is an integrated circuit using an organic carrier board an encapsulation method. It has: ① ② reduce package size function to increase the number of pins increases ③PCB board is dissolved welding self-centered, easy on the tin ④ ⑤ good electrical performance, high reliability, and low overall cost. BGA PCB board has more holes in general, most customers BGA lower through-bore design for the finished hole diameter 8 ~ 12mil, BGA surface at a distance from the hole to fit specifications for 31.5mil for example, is generally not less than 10.5mil. BGA vias required under the plug hole, BGA pads are not allowed on the ink, not drilling on the BGA pads. Parameter:oItemData1Layer:1 to 24 layers2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers3Board thickness:0.20mm to 3.4mm4Copper thickness:0.5 OZ to 4 OZ5Copper thickness in hole:>25.0 um (>1mil)6Max. Board Size: (580mm×1200mm)7Min. Drilled Hole Size:4mil(0.1mm)8Min. Line Width:3mil (0.075mm)9Min. Line Spacing:3mil (0.075mm)10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold platingCompetitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB . What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable. Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:[email protected]:0755-26055813Fax:0755-26055946Skype:karen-xcepcb
